JPH0727639Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0727639Y2 JPH0727639Y2 JP1989126058U JP12605889U JPH0727639Y2 JP H0727639 Y2 JPH0727639 Y2 JP H0727639Y2 JP 1989126058 U JP1989126058 U JP 1989126058U JP 12605889 U JP12605889 U JP 12605889U JP H0727639 Y2 JPH0727639 Y2 JP H0727639Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- semiconductor device
- spring mechanism
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 79
- 230000008602 contraction Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 description 11
- 230000006378 damage Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989126058U JPH0727639Y2 (ja) | 1989-10-27 | 1989-10-27 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989126058U JPH0727639Y2 (ja) | 1989-10-27 | 1989-10-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0365254U JPH0365254U (en]) | 1991-06-25 |
| JPH0727639Y2 true JPH0727639Y2 (ja) | 1995-06-21 |
Family
ID=31673897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989126058U Expired - Fee Related JPH0727639Y2 (ja) | 1989-10-27 | 1989-10-27 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727639Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4764979B2 (ja) * | 2004-06-08 | 2011-09-07 | 富士電機株式会社 | 半導体装置 |
| JP5460560B2 (ja) * | 2010-11-11 | 2014-04-02 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01302753A (ja) * | 1988-05-30 | 1989-12-06 | Sansha Electric Mfg Co Ltd | 樹脂封止型半導体装置 |
-
1989
- 1989-10-27 JP JP1989126058U patent/JPH0727639Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365254U (en]) | 1991-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |